Qualcomm Senior Lead Engineer interview questions

Telephonic followed by 2-3 face to face technical rounds followed by HR. Telephonic is not that tough. First Face to face will be little difficult followed by decreasing level of difficulty. General C questions like linked list, static, volatile, embedded basics and OS concepts.

As many rounds as the group head wants, 6 or 7. 1st round is telephonic, then 7 face to face interviews.Many questions repeat,this can be avoided by joint interviews or each panel can ask only on one topic. Decision is usually quick, and the offer was made within 2 weeks.Not much of a hassle like in other companies.