Description of professional activities / tasks:

• Die bonding and wire bonding
  • Operating the bonders, including switching on, setup, and switching off
  • Taking released materials such as adhesives and printed circuit boards / ceramics from storage
  • Changing programs
  • Monitoring the process
  • Documentation on accompanying documents and in the ERP system
• Related tasks
  • Curing / tempering
  • Plasma etching
• Assembly of lenses and other components
• Quality control
  • Incoming goods inspection of materials
    • Printed circuit boards and ceramics
    • Conductive adhesive, adhesive, and bonding wire
    • Chips (inspection of the foils for tension, assignment to the batch, and clear labeling)
    • Preparation of approvals by sample fitting according to work instructions
  • Post-bond inspection by means of
    • Visual inspection
    • Measurement of pull and shear values
• Carrying out additional tasks as required by operational needs, provided the necessary suitability, qualifications, and training are available
• Maintenance
  • Care and maintenance of work equipment and workstations
  • Cleaning of workstations and machines in accordance with maintenance regulations and instructions

General tasks:

• Compliance with personal occupational safety requirements, especially when working on machines
• Responsibility for cleanliness at machines and workstations
• Responsibility for monitoring minimum stock levels of specified materials, tools, and auxiliary supplies
• If required, responsibility for the proper use of workshop machines
• Compliance with the requirements of ISO 9001 and the corresponding internal documentation, especially work instructions and forms
• Participation in implementing the quality policy and achieving company goals
• Performance of additional tasks as required by operational needs, provided the necessary aptitude, qualifications, and training are in place

Professional requirements:

Formal vocational training is not strictly required, but desirable. The activity itself will be taught on the job.

• Ability to maintain a high level of concentration during manual work and inspection tasks under a microscope (fine motor manual activities)
• Ability to reliably recognize technical relationships and process deviations
• Appropriate qualifications
• High level of production discipline and reliability
• Careful and clean handling of chemicals

Personal requirements:

• Suitability for work under semiconductor manufacturing conditions
• Appropriate personal and physical fitness
• Ability to work in a team
• Ability to handle conflict
• Quick comprehension
• Mental flexibility
• Confident demeanor
• Organizational skills